# US 11,897,079 B2 · Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,897,079 B2 - Document ID: US11897079B2 - Status: Granted - Kind: B2 - Application number: 16/831,436 - Filed: 2020-03-26 - Published: 2021-02-18 - Granted: 2024-02-13 - Earliest claimed: 2019-08-13 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Haosheng Wu; Hari Soundararajan; Jianshe Tang; Shou-Sung Chang; Brian J. Brown; Yen-Chu Yang; You Wang; Rajeev Bajaj - Web page: https://patentgrep.com/patent/US11897079B2 ## CPC - B24B 37/015: Temperature control - B24B 37/105: {the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement} - B24B 55/03: designed as a complete equipment for feeding or clarifying coolant - B24B 37/042: {operating processes therefor} - B24B 49/14: taking regard of the temperature during grinding - H10P 52/402: {of semiconductor materials} - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation. ## Claims ### Claim 1 A method of chemical mechanical polishing, comprising: bulk polishing of a substrate with a polishing pad, a polishing surface of the polishing pad having a first temperature; metal clearing the substrate; and over-polishing, after the metal clearing, the substrate with the polishing pad with a temperature of the polishing surface of the polishing pad lowered for the over-polishing by a coolant to have a second temperature that is lower than the first temperature of the polishing surface of the polishing pad during bulk polishing. ### Claim 2 (depends on 1) The method of claim 1, wherein lowering the temperature includes flowing the coolant onto the polishing surface through one or more nozzles suspended on an arm over the polishing surface of the polishing pad. ### Claim 3 (depends on 2) The method of claim 2, wherein the coolant comprises a liquid coolant medium. ### Claim 4 (depends on 3) The method of claim 3, wherein the liquid coolant medium comprises one or more of liquid nitrogen or water. ### Claim 5 (depends on 2) The method of claim 2, wherein the coolant comprises a gas coolant medium. ### Claim 6 (depends on 5) The method of claim 5, wherein the gas coolant medium includes nitrogen or carbon dioxide. ### Claim 7 (depends on 5) The method of claim 5, comprising flowing the gas coolant medium from a source of compressed gas. ### Claim 8 (depends on 5) The method of claim 5, comprising directing the gas coolant medium through a vortex tube to direct a cold stream of gas onto the polishing pad. ### Claim 9 (depends on 2) The method of claim 2, comprising starting and stopping fluid flow through the one or more nozzles. ### Claim 10 A method of chemical mechanical polishing, comprising: bulk polishing of a substrate with a polishing pad, a polishing surface of the polishing pad having a first temperature; and conditioning the polishing pad with a temperature of the polishing surface of the polishing pad lowered by a coolant for the conditioning to have a second temperature that is lower than the first temperature of the polishing surface of the polishing pad during bulk polishing. ### Claim 11 (depends on 10) The method of claim 10, wherein lowering the temperature includes flowing the coolant onto the polishing surface through one or more nozzles suspended on an arm over the polishing surface of the polishing pad. ### Claim 12 (depends on 11) The method of claim 11, wherein the coolant comprises a liquid coolant medium. ### Claim 13 (depends on 12) The method of claim 12, wherein the liquid coolant medium comprises one or more of liquid nitrogen or water. ### Claim 14 (depends on 11) The method of claim 11, wherein the coolant comprises a gas coolant medium. ### Claim 15 (depends on 14) The method of claim 14, wherein the gas coolant medium includes nitrogen or carbon dioxide. ### Claim 16 (depends on 14) The method of claim 14, comprising flowing the gas coolant medium from a source of compressed gas. ### Claim 17 (depends on 14) The method of claim 14, comprising directing the gas coolant medium through a vortex tube to direct a cold stream of gas onto the polishing pad. ### Claim 18 (depends on 11) The method of claim 11, comprising starting and stopping fluid flow through the one or more nozzles.