Structure and mechanism for electrically-connecting an external-conductor
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsMax Richter, Olaf Bartz
Life of this patent
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Abstract
The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.
Claims16
A structure for electrically connecting an external conductor, said structure comprising:
- a wiring substrate comprising a stack based arrangement of a plurality of layers, said layers defined as electrically conducting layers and insulating layer;
- and a rivet supported from the wiring substrate, said rivet comprising:
- a) an embedded portion within the wiring substrate, wherein said embedded-portion comprises:
- an upper section extending through the stack of the plurality of layers;
- and a bottom section extending laterally with reference to the upper section;
- and b) a portion protruding from wiring substrate for receiving an external conductor and thereby electrically connecting with the wiring substrate, wherein the wiring substrate is a printed circuit substrate (PCB) composed of a pattern of dielectric layers and copper layers;
- and
- wherein the bottom section is embedded within the insulating layer of the wiring substrate, the insulating layer corresponding to a non-conducting substrate of the PCB.
A structure for electrically connecting an external conductor, said structure comprising:
- a wiring substrate comprising a stack based arrangement of a plurality of layers, said layers defined by electrically conducting layer and insulating layers;
- at least one rivet embedded within the wiring substrate, said rivet comprising an upper section extending through the stack of the plurality of layers, and a bottom section extending laterally within the wiring substrate with reference to the upper section;
- and a metallic-post vertically extending from the upper section of the rivet for receiving an external conductor and thereby electrically connecting the conductor with the wiring substrate via the rivet, wherein the wiring substrate is a printed circuit substrate (PCB) composed of a pattern of dielectric layers and copper layers;
- and wherein the bottom section is embedded within the insulating layer of the wiring substrate, the insulating layer corresponding to a non-conducting substrate of the PCB.
Dependencies are inferred from the claim text.