Substrate processing method and substrate processing device
AssigneeSCREEN Holdings Co., Ltd.
InventorsDai Ueda, Yuta Sasaki, Yosuke Hanawa, Hiroaki Kitagawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeSCREEN Holdings Co., Ltd.
InventorsDai Ueda, Yuta Sasaki, Yosuke Hanawa, Hiroaki Kitagawa
Estimating the term…
A substrate processing technique including a process of forming a liquid film on an upper surface of a substrate and excellently solidifying the liquid film is provided. A substrate processing method includes an atmosphere control step of supplying a drying gas to a front surface of a substrate on which a pattern has been formed and to which a liquid has adhered and making a dry atmosphere around the front surface of the substrate, a to-be-solidified liquid supplying step of supplying a to-be-solidified liquid to the front surface of the substrate, and a solidification step of forming a solidified mass by solidifying a liquid film of the to-be-solidified liquid. The atmosphere control step is started before the liquid film of the to-be-solidified liquid supplied to the front surface of the substrate in the to-be-solidified liquid supplying step is formed.
A substrate processing method, comprising:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.