# US 11,896,365 B2 · MEMS device for an implant assembly

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- Number: US 11,896,365 B2
- Document ID: US11896365B2
- Status: Granted
- Kind: B2
- Application number: 18/114,544
- Filed: 2023-02-27
- Published: 2023-10-12
- Granted: 2024-02-13
- Earliest claimed: 2011-06-30
- Assignees: Endotronix, Inc.
- Applicants: Endotronix, Inc.
- Inventors: Mohammad Faisal Zaman; Jeffrey Fong; Julian Chee; Tyler Panian; Michael Nagy
- Web page: https://patentgrep.com/patent/US11896365B2

## CPC

- A61B 5/076: {Permanent implantation}
- A61B 5/0031: {Implanted circuitry}
- A61B 5/01: Measuring temperature of body parts {; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue} (clinical contact thermometers G01K13/20)
- A61B 5/0215: by means inserted into the body
- A61B 5/02152: {specially adapted for venous pressure}
- A61B 5/036: {by means introduced into body tracts (A61B5/032 and A61B5/035 take precedence)}
- A61B 5/6876: {Blood vessel}
- A61B 5/08: Measuring devices for evaluating the respiratory organs
- A61B 5/6869: {Heart}
- A61B 2562/0247: Pressure sensors
- A61B 2562/168: Fluid filled sensor housings
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)

## Abstract

Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.

## Claims

### Claim 1

A method of assembling an implant comprising:
providing a housing that defines a cavity;
attaching a floating base to a diaphragm by bonding, to form a capacitive gap, said attachment being positioned along a perimeter of said capacitive gap and including at least one discontinuity in bonding to enhance at least one performance parameter of said implant;
patterning at least one electrode onto the floating base;
attaching said diaphragm to said housing such that said floating base is positioned entirely within said cavity;
attaching a coil to said at least one electrode; and
attaching a bottom to said housing to form a hermetic seal about said cavity.

### Claim 2 (depends on 1)

The method of claim 1, wherein said diaphragm is hermetically attached to said housing by at least one laser weld about the perimeter of said cavity.

### Claim 3 (depends on 1)

The method of claim 1, wherein said diaphragm is made of a glass material and said floating base is made of silicon.