Current sensor package with continuous insulation
AssigneeInfineon Technologies AG
InventorsRainer Markus Schaller, Volker Strutz
Life of this patent
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Abstract
A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.
Claims19
A method of manufacturing a current sensor package, the method comprising:
- providing a current path;
- providing a sensing device, in particular a sensor chip, the sensing device being configured for sensing a magnetic field generated by a current flowing through the current path and comprising a sensor element;
- positioning the sensing device spaced from the current path;
- electrically connecting the sensing device to a conductive trace;
- providing an encapsulant extending continuously between the current path and the sensing device;
- the encapsulant extending continuously between the current path and the conductive trace;
- providing a support element for the conductive trace before providing the encapsulant;
- removing the support element after providing the encapsulant about the conductive trace and the support element, the removed support element leaving a hole in the encapsulant;
- and
- filling the hole in the encapsulant with an electrically insulating filling material.
A method of manufacturing a current sensor package, comprising:
- providing a current path;
- providing a sensing device, in particular a sensor chip, including positioning the sensing device spaced from the current path, and the sensing device being configured for sensing a magnetic field generated by a current flowing through the current path, the sensing device comprising a sensor element;
- electrically connecting the sensing device to a conductive trace;
- providing a mounting side which is configured to be mounted to a support;
- providing an encapsulant extending continuously between the current path and the sensing device and between the current path and the mounting side where the sensing device extends over the current path;
- the encapsulant extending continuously between the current path and the conductive trace;
- and
- attaching the sensing device to the encapsulant.
A method of manufacturing a current sensor package comprising:
- forming a premold part including an encapsulant, a conductive trace, a current path, and an attachment surface;
- providing a sensing device, in particular a sensor chip, including positioning the sensing device spaced from the current path, and the sensing device being configured for sensing a magnetic field generated by a current flowing through the current path, the sensing device comprising a sensor element;
- electrically connecting the sensing device to the conductive trace;
- providing a mounting side which is configured to be mounted to a support;
- extending the encapsulant continuously between the current path and the sensing device and between the current path and the mounting side where the sensing device extends over the current path;
- the encapsulant extending continuously between the current path and the conductive trace;
- and
- attaching the sensing device to the attachment surface.
Dependencies are inferred from the claim text.