Semiconductor memory device and fabrication method thereof
AssigneeUnited Microelectronics Corp.
InventorsChia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
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Abstract
A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
Claims14
A semiconductor memory device, comprising:
- a substrate comprising a conductor region thereon;
- an interlayer dielectric layer on the substrate;
- a conductive via electrically connected to the conductor region, wherein the conductive via comprises a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer, wherein the upper portion has a rounded top surface, wherein the upper portion has a width that is equal to or smaller than a width of the lower portion;
- and
- a storage structure conformally covering the rounded top surface.
A semiconductor memory device, comprising:
- a substrate comprising a conductor region thereon;
- an interlayer dielectric layer on the substrate;
- a conductive via electrically connected to the conductor region, wherein the conductive via comprises a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer, wherein the upper portion has a flat top surface and a round edge surface extending between the flat top surface and a sidewall surface of the upper portion, wherein the upper portion has a width that is equal to or smaller than a width of the lower portion;
- and
- a storage structure conformally covering the rounded top surface.
Dependencies are inferred from the claim text.