Additive manufacturing for integrated circuit assembly cables
AssigneeIntel Corporation
InventorsGeorgios Dogiamis, Adel Elsherbini, Feras Eid
Life of this patent
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Abstract
Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.
Claims20
A cable, comprising:
- a cable core;
- a shielding layer substantially surrounding the cable core;
- a seam line defined by the shielding layer extending along a length of the cable core;
- an additive weld spanning the seam line;
- and
- a coating layer over the shielding layer and the additive weld, the coating layer comprising a heat-shrink tubing.
An integrated circuit assembly, comprising:
- an electronic substrate;
- a cable connector electrically attached to the electronic substrate;
- a cable attached to the cable connector, wherein the cable comprises:
- a cable core;
- a shielding layer substantially surrounding the cable core;
- a seam line defined by the shielding layer extending along a length of the cable core;
- an additive weld spanning the seam line;
- and
- a coating layer over the shielding layer and the additive weld, the coating layer comprising a heat-shrink tubing.
An integrated circuit assembly, comprising:
- a cable connector comprising a first component abutting a second component;
- a seam line between the first component and the second component;
- and
- an additive weld spanning the seam line.
Dependencies are inferred from the claim text.