US 11,895,811 B2 · Curved electronic device and method for manufacturing the same

Curved electronic device and method for manufacturing the same

AssigneesInterface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., Interface Optoelectronics (Wuxi) Co., Ltd., General Interface Solution Limited

InventorsPing-Hsiang Kao, Wen-You Lai, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu

Life of this patent

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Abstract

A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

Claims14

Dependent claims

A curved electronic device, comprising:

a substrate;
a component layer, disposed on the substrate, the component layer being composed of a plurality of electronic components and their connecting wiring arranged on the substrate;
and
a modulation layer, disposed on the component layer and including at least one pattern area and at least one blank area that are formed on the component layer, wherein the blank area allows one part of the electronic components to be exposed out of the modulation layer, a position of the substrate corresponding to the pattern area and a position of the substrate corresponding to the blank area have different heat absorption rates.

1 more element

A method for manufacturing a curved electronic device, comprising the steps of:

providing a component layer on a substrate, wherein the component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate;
providing a modulation layer on the component layer, the modulation layer including at least one pattern area and at least one blank area that are formed on the component layer, the substrate, the component layer and the modulation layer constituting a semi-finished product, wherein the position of the blank area corresponds to at least one part of the electronic components, and the pattern area covers all the positions of the component layer except the blank area;
placing the semi-finished product in a thermoforming mold for performing a thermoforming process, wherein in the thermoforming process, according to the difference in the heat absorption rate of the pattern area and the blank area, the degree of stretching of the substrate corresponding to the pattern area and the blank area is different.

Dependencies are inferred from the claim text.

Facts

Application

17/519,153Filed 4 Nov 2021

Priority

CN 202111171989.98 Oct 2021

Published

US 2023/0114927 A113 Apr 2023

Granted

6 Feb 2024

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H05K 7/20963
For display panels: heat transfer by conduction from internal heat source to heat radiating structure
H10W 90/00
Package configurations
G09F 9/301
In which the desired character or characters are formed by combining individual elements: flexible foldable or roll-able electronic displays, e.g.…
B29C 51/426
Heating or cooling: producing specific thermal regimes during thermoforming to obtain particular properties