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US 11,895,802 B2Granted
Computational heat dissipation structure, computing device comprising same, mine
AssigneeCanaan Creative Co., Ltd.
InventorsNing Zhang, Nangeng Zhang
Life of this patent
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AssigneeCanaan Creative Co., Ltd.
InventorsNing Zhang, Nangeng Zhang
Estimating the term…
A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.
A circuit board, comprising a plurality of heat-generating components, wherein a spacing between adjacent heat-generating components of the plurality of heat-generating components is negatively correlated with a heat dissipation efficiency of a region where the adjacent heat-generating components are located, wherein:
A heat dissipation structure, comprising a plurality of heat-generating components, wherein a spacing between adjacent heat-generating components of the plurality of heat-generating components is negatively correlated with a heat dissipation efficiency of a region where the adjacent heat-generating components are located, wherein:
A computing device, comprising:
Dependencies are inferred from the claim text.