Data processing systems including optical communication modules

An apparatus comprising:

• a housing comprising a front panel;
• a first substrate having a first side and a second side;
• a first electronic processing module mounted directly or indirectly on the first side of the first substrate, wherein the first electronic processing module is configured to process data;
• and
• a first optical interconnect module mounted directly or indirectly on the second side of the first substrate, wherein the first optical interconnect module comprises:
• an optical port configured to receive optical signals, and
• a photonic integrated circuit configured to generate electrical signals based on the received optical signals, and transmit the electrical signals to the first electronic processor;
• wherein the first substrate is spaced apart at a first distance from the front panel, the first distance is less than 24 inches, the first substrate is at a first angle relative to the front panel, the first angle is in a range from −60° to 60°.

An apparatus comprising:

• a housing comprising a front panel;
• a first substrate having a first side and a second side;
• a first electronic processor mounted directly or indirectly on the first side of the first substrate, wherein the first electronic processor is configured to process data;
• and
• a first optical interconnect module comprising:
• an optical port configured to receive optical signals from a first optical fiber cable, and
• a photonic integrated circuit configured to generate electrical signals based on the received optical signals, and transmit the electrical signals to the first electronic processor;
• wherein at least one of the first optical interconnect module, the first optical fiber cable, a portion of the first optical interconnect module, or a portion of the first optical fiber extends through an opening in the first substrate;
• and
• wherein the first substrate is spaced apart at a first distance from the front panel, the first distance is less than 24 inches, the first substrate is at a first angle relative to the front panel, and the first angle is in a range from −60° to 60°.

A system comprising:

• a housing comprising a front panel;
• a first circuit board or a first substrate, wherein at least one of (i) the first circuit board or the first substrate is attached to the front panel, or (ii) the first circuit board or the first substrate is part of the front panel;
• at least one data processing module electrically coupled to the first circuit board or the first substrate;
• and
• at least one optical/electrical communication interface module electrically coupled to the at least one data processing module through the first circuit board or the first substrate;
• wherein the at least one data processing module is capable of processing data from the at least one optical/electrical communication interface module at a rate of at least 100 gigabits per second, and each of the at least one optical/electrical communication interface module has a bandwidth of at least 10 gigabits per second;
• wherein each optical/electrical communication interface module comprises:
• a first optical connector configured to connect to an external optical link, and
• a photonic integrated circuit configured to generate an electrical signal based on an optical signal received from the first optical connector;
• wherein the at least one data processing module comprises a plurality of data processing modules, the at least one optical/electrical communication interface modules comprises a plurality of optical/electrical communication interface modules;
• and
• wherein the plurality of data processing modules and the plurality of photonic integrated circuits are mounted directly or indirectly on a same side of the first circuit board or the first substrate.