Miniaturized impedance sensors

An apparatus, comprising:

• a layered miniaturized impedance sensor, comprising:
• a patterned conductive layer, wherein a conductive layer pattern comprises regions of conductive material adjacent to regions of non-conductive material, wherein:
• regions of conductive material are spaced from each other to prevent capacitive coupling and arcing between the regions of conductive material;
• and
• the patterned conductive layer is conductive of an electrical signal to or from a miniaturized electrode;
• an insulating layer disposed on the patterned conductive layer;
• a patterned catalyst layer, wherein a catalyst layer pattern is aligned with the conductive layer pattern;
• a patterned array of miniaturized electrodes, wherein a miniaturized electrode pattern is aligned with the conductive layer pattern or the catalyst layer pattern;
• and
• an interstitial filler disposed between individual miniaturized electrodes of the patterned array of miniaturized electrodes;
• and
• a substrate, wherein:
• the layered miniaturized impedance sensor is attached to the substrate;
• the substrate comprises a shape and flexibility to integrate the substrate and the layered miniaturized impedance sensor into a wearable device;
• the substrate comprises an interstitial filler;
• the interstitial filler comprises a rigid material and a flexible material;
• the rigid material is disposed within subsets of the patterned array of miniaturized electrodes;
• and
• the flexible material is disposed between the subsets of the patterned array of miniaturized electrodes.

A device, comprising:

• a layered miniaturized impedance sensor, comprising:
• a growth substrate, wherein:
• the growth substrate comprises a surface roughness less than or equal to 1 nanometer;
• and
• the growth substrate is configured to withstand infiltration at a threshold temperature for a physical vapor deposition (PVD) process or a chemical vapor deposition (CVD) process;
• the growth substrate comprises an interstitial filler;
• the interstitial filler comprises a rigid material and a flexible material;
• a first insulating layer disposed on the growth substrate, wherein the first insulating layer is configured to prevent molecular reaction of a deposition material with the growth substrate during a PVD process or a CVD process;
• a conductive layer patterned on the first insulating layer, wherein a conductive layer pattern comprises regions of conductive material adjacent to regions of non-conductive material, wherein regions of conductive material are spaced from each other to prevent capacitive coupling and arcing between the regions of conductive material;
• a second insulating layer disposed on the conductive layer, wherein the first insulating layer or the second insulating layer is disposed on the patterned conductive layer;
• a catalyst layer patterned on the second insulating layer, wherein a catalyst layer pattern is aligned with the conductive layer pattern;
• and
• a miniaturized electrode grown on the catalyst layer;
• wherein:
• the deposition material comprises:
• the conductive layer;
• the second insulating layer;
• the catalyst layer;
• or
• the miniaturized electrode;
• the first insulating layer is susceptible to an etching process to remove a portion of the first insulating layer from the growth substrate or the conductive layer;
• two patterns are aligned with each other, the two patterns comprising:
• a conductive layer pattern;
• a catalyst layer pattern;
• or
• a miniaturized electrode pattern;
• the conductive layer is conductive of an electrical signal to or from the miniaturized electrode;
• the second insulating layer is rendered conductive by an environmental condition for growth of the miniaturized electrode on the catalyst layer;
• the second insulating layer enhances growth of the miniaturized electrode on the catalyst layer;
• the conductive layer, the second insulating layer, or the miniaturized electrode are removable from the growth substrate;
• the catalyst layer is configured to stimulate growth of the miniaturized electrode during the PVD process or the CVD process;
• the layered miniaturized impedance sensor is attached to the growth substrate;
• and
• the growth substrate comprises a shape and flexibility to integrate the growth substrate and the layered miniaturized impedance sensor into a wearable device;
• a patterned array of miniaturized electrodes, wherein a miniaturized electrode pattern is aligned with the conductive layer pattern or the catalyst layer pattern, wherein:
• the rigid material of the interstitial filler is disposed within subsets of the patterned array of miniaturized electrodes;
• and
• the flexible material of the interstitial filler is disposed between the subsets of the patterned array of miniaturized electrodes;
• and
• an interstitial filler disposed between individual miniaturized electrodes of the patterned array of miniaturized electrodes.