Flexible inlay and manufacturing method thereof
AssigneeIDEX Biometrics ASA
InventorDavid N. Light
Life of this patent
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Abstract
A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.
Claims35
A method for manufacturing a flex inlay having an essentially planar surface, the method comprising:
- providing a flexible printed circuit having opposed first and second surfaces;
- attaching components to the first surface of the flexible printed circuit;
- and
- applying a coverlay over at least the first surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the first surface of the flexible printed circuit;
- wherein the coverlay at least in part forms the essentially planar surface of the flex inlay.
A flex inlay comprising:
- a flexible printed circuit having opposed first and second surfaces;
- components attached to the first surface of the flexible printed circuit, the first surface being one of the opposed first and second surfaces;
- a coverlay over at least the first surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the first surface of the flexible printed circuit;
- wherein the flex inlay has an essentially planar surface and the coverlay at least in part forms the essentially planar surface of the flex inlay.
Dependencies are inferred from the claim text.