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US 11,895,776 B2Granted
Flexible printed wiring board, joined body, pressure sensor and mass flow controller
AssigneeHitachi Metals, Ltd.
InventorTakahiro Umeyama
Life of this patent
Estimating the term…
Abstract
In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.
Claims26
A flexible printed wiring board having:
- an insulation substrate comprising a first surface that is a surface on which a bare chip is mounted and a second surface that is a surface located on an opposite side of said first surface;
- one or more first electrical conduction patterns which are prepared on said first surface and include first electrode parts arranged at positions where the first electrode part can be electrically connected with a bump of said bare chip in a mounted state that is a state where said bare chip is mounted on said first surface;
- one or more through holes drilled in said insulation substrate, and
- one or more second electrical conduction patterns prepared on said second surface;
- wherein:
- at least a part of said first electrical conduction patterns further comprise a first electrical conduction part that is a part for electrically connecting said first electrode part with said through hole;
- at least a part of said first electrical conduction patterns and at least a part of said second electrical conduction patterns are electrically connected with each other through said through holes;
- and
- said first electrical conduction patterns are prepared only inside a mounting region that is a region opposite to said bare chip in said mounted state.
6 more elements
A joined body comprising:
- a flexible printed wiring board;
- and
- a bare chip;
- wherein the flexible printed wiring board comprises:
- an insulation substrate comprising a first surface that is a surface on which a bare chip is mounted and a second surface that is a surface located on an opposite side of said first surface;
- one or more first electrical conduction patterns which are prepared on said first surface and include first electrode parts arranged at positions where the first electrode part can be electrically connected with a bump of said bare chip in a mounted state that is a state where said bare chip is mounted on said first surface;
- one or more through holes drilled in said insulation substrate;
- and
- one or more second electrical conduction patterns prepared on said second surface;
- wherein:
- at least a part of said first electrical conduction patterns further comprise a first electrical conduction part that is a part for electrically connecting said first electrode part with said through hole;
- at least a part of said first electrical conduction patterns and at least a part of said second electrical conduction patterns are electrically connected with each other through said through holes;
- and
- said first electrical conduction patterns are prepared only inside a mounting region that is a region opposite to said bare chip in said mounted state.
11 more elements
A pressure sensor comprising:
- a flexible printed wiring board;
- and
- a strain sensor;
- wherein the flexible printed wiring board comprises:
- an insulation substrate comprising a first surface that is a surface on which said strain sensor is mounted and a second surface that is a surface located on an opposite side of said first surface;
- one or more first electrical conduction patterns which are prepared on said first surface and include first electrode parts arranged at positions where the first electrode part can be electrically connected with a bump of said strain sensor in a mounted state that is a state where said strain sensor is mounted on said first surface;
- one or more through holes drilled in said insulation substrate, and
- one or more second electrical conduction patterns prepared on said second surface;
- wherein:
- at least a part of said first electrical conduction patterns further comprise a first electrical conduction part that is a part for electrically connecting said first electrode part with said through hole;
- at least a part of said first electrical conduction patterns and at least a part of said second electrical conduction patterns are electrically connected with each other through said through holes;
- and
- said first electrical conduction patterns are prepared only inside a mounting region that is a region opposite to said strain sensor in said mounted state.
10 more elements
A mass flow controller comprising:
- a pressure sensor comprising:
- a flexible printed wiring board;
- and
- a strain sensor;
- wherein the flexible printed wiring board comprises:
- an insulation substrate comprising a first surface that is a surface on which said strain sensor is mounted and a second surface that is a surface located on an opposite side of said first surface;
- one or more first electrical conduction patterns which are prepared on said first surface and include first electrode parts arranged at positions where the first electrode part can be electrically connected with a bump of said strain sensor in a mounted state that is a state where said strain sensor is mounted on said first surface;
- one or more through holes drilled in said insulation substrate, and
- one or more second electrical conduction patterns prepared on said second surface;
- wherein:
- at least a part of said first electrical conduction patterns further comprise a first electrical conduction part that is a part for electrically connecting said first electrode part with said through hole;
- at least a part of said first electrical conduction patterns and at least a part of said second electrical conduction patterns are electrically connected with each other through said through holes;
- and
- said first electrical conduction patterns are prepared only inside a mounting region that is a region opposite to said strain sensor in said mounted state;
- and
- means for monitoring pressure of fluid by said pressure sensor.
13 more elements
Dependencies are inferred from the claim text.