Modular power electronics converters with enhanced connectivity reliability and simplified method of fabrication

A hybrid power switch module, comprising:

• a first printed circuit board (PCB) having a first and a second sides,
• a second PCB having a third and a fourth sides, said second PCB being secured to said first PCB with said second and fourth sides thereof facing each other,
• a first plurality of switch dies and a second plurality of switch dies having a respective predetermined topology on a respective one of said first and third sides of said first and second PCBs, respectively, wherein at least one first switch die of said first plurality thereof and at least one second switch die of said second plurality thereof are disposed in a double-sided fashion on said first and third sides, respectively, of said first and second PCBs, wherein each of first and second pluralities of said switch dies includes a gate terminal and a source terminal facing a respective one of said first and third sides of said first and second PCBs, respectively,
• a plurality of spring pins, each soldered in a respective through-hole via (THV) formed through each of said first and second PCBs in alignment with said gate terminal of each switch die, each of said plurality of spring pins having a first cap at one end thereof in electrical contact with said gate terminal and a second cap at another end of said each spring pin exposed from said respective THV and secured to a respective one of said second and fourth sides of said first and second PCBs, respectively, and
• a plurality of multi-functional components (MFCs), each expanded vertically from a respective one of said first and third sides of the first and second PCBs, respectively, and secured to said first and second pluralities of the switch dies through an elastic metal contact.

A method for fabrication of a hybrid double-sided power switch module, comprising:

• forming a first printed circuit board (PCB) and a second PCB, wherein said PCB has a first side and a second side opposite to said first side, and wherein said second PCB has a third side and a fourth side opposite to said third side, and
• configuring each of said first and second PCB s with at least one respective through-hole-via (THV) extending between said first and second sides of said first PCB and between said third and fourth sides of said second PCB;
• securing at least one first switch die to said first side of said first PCB with a gate terminal of said at least first switch die facing said first side of said first PCB in alignment with said at least one THV formed through said first PBC, and
• soldering at least one first spring pin inside said at least one THV formed through said first PCB by a high-temperature solder paste, said at least one first spring pin having a first conductive body with a first cap formed at one end of said first conductive body and a second cap formed at another end of said first conductive body, wherein said at least one first spring pin has said first cap aligned and in contact with said gate terminal of said at least one first switch die, and wherein said second cap is exposed at said second side of said first PCB in alignment and contact with said at least one THV formed through said first PCB;
• securing at least one second switch die to said third side of said second PCB with a gate terminal of said at least one second switch die facing said third side of said second PCB in alignment with said at least one THV formed through said second PCB, and
• soldering at least one second spring pin inside said at least one THV formed through said second PCB by said high-temperature solder paste, said at least one second spring pin having a second conductive body with a third cap formed at one end of said second conductive body and a fourth cap formed at another end of said second conductive body, wherein said at least one second spring pin has said third cap aligned and in contact with said gate terminal, and wherein said fourth cap is exposed at said fourth side of said second PCB in alignment and in contact with said at least one THV formed through said second PCB;
• and
• securing said first and second PCBs to one another by a low-temperature solder paste with said second and fourth sides thereof facing each other, thus forming a double PCB assembly with said at least first and second switch dies secured at said first and third sides and interconnected to configure the power switch module configuration.