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US 11,895,771 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Uk Lee, Young Ook Cho, Eun Sun Kim, Young Hun You
Life of this patent
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Abstract
A printed circuit board includes: a first insulating layer; a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer; and a first via layer disposed on the via pad, wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers.
Claims20
A printed circuit board comprising:
- a first insulating layer;
- a second insulating layer disposed on the first insulating layer;
- a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer and embedded in the second insulating layer, the second layer directly contacting the first layer;
- and
- a first via layer disposed on one side of the via pad, connected to the first layer and penetrating through at least a portion of the first insulating layer, and a second via layer disposed on an opposing side of the via pad, connected to the second layer and penetrating through at least a portion of the second insulating layer,
- wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers,
- each of the first and second layers of the via pad includes a metal material,
- the second via layer is in contact with the second layer and has a tapered side surface, and
- each of the first and second insulating layers is a single layer.
6 more elements
A printed circuit board comprising:
- a first insulating layer;
- a second insulating layer disposed on the first insulating layer;
- a via pad and a fine circuit unit at least partially embedded in the first insulating layer;
- a first via layer penetrating through at least a portion of the first insulating layer and disposed on one side of the via pad in a stacking direction;
- and
- a second via layer penetrating through at least a portion of the second insulating layer and disposed on an opposing side of the via pad in a stacking direction,
- wherein the via pad has a step portion,
- the via pad includes a first layer and a second layer, the second layer being disposed on and directly contacting a first surface of the first layer,
- each of the first and second layers of the via pad includes a metal material, the first and second layers of the via pad are distinct layers having a physical interface therebetween, and
- each of the first and second insulating layers is a single layer.
7 more elements
A printed circuit board comprising:
- a first insulating layer having a first surface and a second surface opposing each other in a stacking direction;
- a second insulating layer disposed on the first surface of the first insulating layer;
- a via pad at least partially embedded in the first insulating layer;
- a fine circuit unit embedded in the first insulating layer, exposed to the first surface of the first insulating layer, and disposed adjacent to a side of the via pad in a width direction perpendicular to the stacking direction;
- a first via layer embedded in the first insulating layer, exposed to the second surface of the first insulating layer, and connected to one side of the via pad;
- and
- a second via layer embedded in the second insulating layer and connected to an opposing side of the via pad,
- wherein the fine circuit unit is not in direct contact with any conductive element, and each of the first and second insulating layers is a single layer.
5 more elements
Dependencies are inferred from the claim text.