Induction heating apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsMasashi Sasagawa, Masaki Ono, Masayuki Otawara, Nobuharu Nishikoori, Taro Yoshida, Tomoyuki Kanagawa, Yutaka Yagi
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AssigneeSamsung Electronics Co., Ltd.
InventorsMasashi Sasagawa, Masaki Ono, Masayuki Otawara, Nobuharu Nishikoori, Taro Yoshida, Tomoyuki Kanagawa, Yutaka Yagi
Estimating the term…
An induction heating apparatus is provided. The induction heating apparatus includes a heating coil configured to heat an object to be heated, a full-bridge type inverter configured to supply power to the heating coil, a capacitor provided between an intermediate node of one arm of the inverter and one end of the heating coil, and a first relay provided between the intermediate node and the other end of the heating coil 30. An intermediate node of the other arm of the inverter and an intermediate point of the heating coil are connected through a first wire. The induction heating apparatus includes a processor configured to open or close the first relay based on an impedance of the object to be heated.
An induction heating apparatus comprising:
An induction heating apparatus comprising:
Dependencies are inferred from the claim text.