Solid-state imaging device
AssigneeSony Semiconductor Solutions Corporation
InventorAtsumi Niwa
Life of this patent
Estimating the term…
Abstract
A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
Claims39
An event detection sensor comprising:
- a first chip including:
- a photoelectric conversion region;
- and
- a first portion of current-voltage conversion circuit, wherein the current-voltage conversion circuit is coupled to the photoelectric conversion region, and
- a second chip including:
- a second portion of the current-voltage conversion circuit;
- a buffer coupled to the current-voltage conversion circuit;
- and
- a quantizer coupled to the buffer via a capacitor, wherein the quantizer outputs an event detection signal,
- wherein, the first chip and the second chip are electrically connected by a metal bonding.
An event detection sensor comprising:
- a first chip including:
- a photoelectric conversion region;
- a current-voltage conversion circuit coupled to the photoelectric conversion region;
- and
- a buffer coupled to the current-voltage conversion circuit;
- and
- a second chip including:
- a subtractor coupled to the buffer via a first capacitor;
- a quantizer coupled to the subtractor, the quantizer outputs an event detection signal, wherein, the first chip and the second chips are electrically connected by a metal bonding.
An event detection sensor comprising:
- a first chip including a photoelectric conversion region;
- and
- a second chip including:
- a current-voltage conversion circuit coupled to the photoelectric conversion region;
- a subtractor coupled to the current-voltage conversion circuit via a capacitor;
- and
- a quantizer coupled to the subtractor, the quantizer outputs an event detection signal, wherein, the first chip and the second chips are electrically connected by a metal bonding.
Dependencies are inferred from the claim text.