Back to results
US 11,894,829 B2Granted
Variation of metal layer stack under under bump metallization (UBM)
AssigneeRF360 Singapore Pte. Ltd.
InventorsUte Steinhaeusser, Niklaas Konopka, Alexander Landel
Life of this patent
Estimating the term…
Abstract
In certain aspects, a chip includes a pad, and a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad. The chip also includes a first metal layer between the first portion of the pad and the first portion of the first passivation layer. The chip further includes an under bump metallization (UBM) electrically coupled to a second portion of the pad.
Claims30
A chip, comprising:
- a pad;
- a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad;
- a first metal layer between the first portion of the pad and the first portion of the first passivation layer;
- and
- an under bump metallization (UBM) electrically coupled to a second portion of the pad, wherein a first portion of the UBM is over the second portion of the pad.
2 more elements
A method of manufacture, comprising:
- forming a pad;
- depositing a metal layer on the pad;
- depositing a passivation layer over the metal layer;
- removing a first portion of the passivation layer and a portion of the metal layer to expose a portion of the pad;
- and
- depositing an under bump metallization (UBM) on the portion of the pad and a second portion of the passivation layer.
3 more elements
Dependencies are inferred from the claim text.