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US 11,894,651 B2Granted
Amplifier assembly
AssigneeLumentum Operations LLC
InventorsChristoffer Stroemberg, Susan Fung, Derek A. Tucker
Life of this patent
Estimating the term…
Abstract
An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.
Claims20
A method, comprising:
- assembling an amplifier assembly that includes a first heat sink plate, a second heat sink plate, at least one solder preform, and an amplifier rod,
- wherein the at least one solder preform comprises a non-eutectic solder,
- wherein the amplifier rod is disposed in a first channel of the at least one solder preform and a second channel of the at least one solder preform,
- wherein the first channel of the at least one solder preform is received in a first channel of the first heat sink plate, and the second channel of the at least one solder preform is received in a second channel of the second heat sink plate;
- and
- compressing the amplifier assembly while heating the amplifier assembly at a temperature that causes a reflow of the at least one solder preform.
3 more elements
A method, comprising:
- assembling an amplifier assembly that includes a first heat sink plate, a second heat sink plate, at least one solder preform, and an amplifier rod,
- wherein the at least one solder preform comprises a non-eutectic solder,
- wherein the amplifier rod is disposed in a first channel of the at least one solder preform and a second channel of the at least one solder preform,
- wherein the first channel of the at least one solder preform is received in a first channel of the first heat sink plate, and the second channel of the at least one solder preform is received in a second channel of the second heat sink plate, and
- wherein the first channel and the second channel align;
- and
- compressing the amplifier assembly while heating the amplifier assembly at a temperature that causes a reflow of the at least one solder preform.
4 more elements
A method, comprising:
- assembling an amplifier assembly that includes a first heat sink plate, a second heat sink plate, a first solder preform, a second solder preform, and an amplifier rod,
- wherein the first solder preform and the second solder preform each comprise non-eutectic solder,
- wherein the amplifier rod is disposed in a first channel of the first solder preform and a second channel of the second solder preform,
- wherein the first channel of the first solder preform is received in a first channel of the first heat sink plate, and the second channel of the second solder preform is received in a second channel of the second heat sink plate;
- and
- compressing the amplifier assembly while heating the amplifier assembly at a temperature that causes a reflow of the first solder preform and the second solder preform.
3 more elements
Dependencies are inferred from the claim text.