Coupled transmission line resonate RF filter
Assignee3D Glass Solutions, Inc.
InventorsJeb H. Flemming, Kyle McWethy
Life of this patent
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Abstract
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
Claims22
A method of making a mechanically stabilized RF coupled interdigitated resonant device comprising:
- providing a photosensitive glass substrate;
- masking a design layout comprising one or more interdigitated structures to form one or more interdigitated resonators on the photosensitive glass substrate, wherein each interdigitated resonator is rectangular, and wherein adjacent interdigitated resonators are configured and disposed to couple a signal of a frequency of about 25.25 to 30.75 GHz;
- exposing at least one portion of the photosensitive glass substrate to an activating energy source;
- heating the photosensitive glass substrate for at least ten minutes above a glass transition temperature thereof;
- cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate;
- etching the glass-crystalline substrate with an etchant solution to form a glass mechanical support structure from the photosensitive glass substrate;
- and
- coating the one or more interdigitated structures, a ground plane, an input channel, and an output channel with one or more metals, wherein the one or more metals are configured to be connected to a circuitry.
A mechanically stabilized RF coupled interdigitated resonant device made by a method comprising:
- providing a photosensitive glass substrate;
- masking a design layout comprising one or more interdigitated structures to form one or more interdigitated resonators on the photosensitive glass substrate, wherein each interdigitated resonator is rectangular, and wherein adjacent interdigitated resonators are configured and disposed to couple a signal of a frequency of about 25.25 to 30.75 GHz;
- exposing at least one portion of the photosensitive glass substrate to an activating energy source;
- heating the photosensitive glass substrate for at least ten minutes above glass transition temperature thereof;
- cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate;
- etching the glass-crystalline substrate with an etchant solution to form a glass mechanical support structure from the photosensitive glass substrate;
- coating the one or more interdigitated structures, a ground plane, an input channel, and an output channel with one or more metals;
- and
- connecting the mechanically stabilized RF coupled interdigitated resonant device to a circuitry.
Dependencies are inferred from the claim text.