Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device

A method comprising:

• manufacturing a covering member by performing steps comprising:
• a step of providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings,
• a step of arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole,
• a step of distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin, and
• after the step of distributing the wavelength-conversion material, a step of removing a portion of the light-transmissive resin from a side of the second opening of the through-hole;
• and
• manufacturing the light emitting device by performing steps comprising:
• a step of providing a light-emitting element having a light extraction surface,
• a step of bonding the light extraction surface of the light-emitting element to the light-transmissive resin of the covering member, and
• a step of forming a second light-reflective member so as to be bonded to the first light-reflective member around the light-emitting element and cover a lateral surface of the light-emitting element, wherein:
• the light-emitting element includes an electrode that, after the step of forming the second light-reflective member, is exposed from the second light-reflective member, and
• a surface of the electrode that is exposed from the second light-reflective member has a specular reflectivity higher than a specular reflectivity of a lower surface of the second light-reflective member.