Terahertz device and production method for terahertz device
AssigneeRohm Co., Ltd.
InventorsKazuisao Tsuruda, Jaeyoung Kim, Hideaki Yanagida, Toshikazu Mukai
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Abstract
A terahertz device includes a terahertz element, a sealing resin, a wiring layer and a frame-shaped member. The terahertz element that performs conversion between terahertz waves and electric energy. The terahertz element has an element front surface and an element back surface spaced apart from each other in a first direction. The sealing resin covers the terahertz element. The wiring layer is electrically connected to the terahertz element. A frame-shaped member is made of a conductive material and arranged around the terahertz element as viewed in the first direction. The frame-shaped member has a reflective surface capable of reflecting the terahertz waves.
Claims20
A terahertz device comprising:
- a terahertz element configured to perform conversion between terahertz waves and electric energy and having an element front surface and an element back surface spaced apart from each other in a first direction;
- a sealing resin covering the terahertz element;
- a wiring layer electrically connected to the terahertz element;
- and
- a frame-shaped member made of a conductive material and arranged around the terahertz element as viewed in the first direction,
- wherein the frame-shaped member has a reflective surface capable of reflecting the terahertz waves.
A method for manufacturing a terahertz device comprising a terahertz element configured to perform conversion between terahertz waves and electric energy and having an element front surface and an element back surface spaced apart from each other in a first direction, the method comprising:
- a support board preparation step for preparing a support board having a support-board front surface and a support-board back surface facing away from each other in the first direction;
- a frame-shaped member forming step for forming a frame-shaped member from a conductive material on the support board;
- a wiring layer forming step for forming a wiring layer electrically connected to the terahertz element;
- an element mounting step for mounting the terahertz element on the support board such that the frame-shaped member is positioned around the terahertz element as viewed in the first direction;
- a sealing resin forming step for forming a sealing resin covering the terahertz element;
- and
- a grinding step for grinding the support board,
- wherein the frame-shaped member has a reflective surface capable of reflecting the terahertz waves.
Dependencies are inferred from the claim text.