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US 11,894,485 B2Granted
Solar cell wafer wire bonding method
AssigneeMaxeon Solar Pte. Ltd.
InventorsVergil R. Sandoval, Emmanuel C. Abas, Yafu Lin
Life of this patent
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Abstract
A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
Claims7
A method of attaching wires to a solar cell wafer, the method comprising:
- soldering a first portion of each of a first plurality of wires on a solar cell wafer;
- in a first instance, moving the solar cell wafer to draw the first plurality of wires across the solar cell wafer;
- after moving the solar cell wafer in the first instance, soldering a second portion of each of the first plurality of wires on the solar cell wafer;
- cutting each of the first plurality of wires;
- and
- in a second instance, moving the solar cell wafer to create a gap between the first plurality of wires and a second plurality of wires on the solar cell wafer.
3 more elements
Dependencies are inferred from the claim text.