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US 11,894,482 B2Granted
Systems and methods for making solar panels or components thereof
AssigneeDual Helios Semiconductor Equipment Company, Inc.
InventorLawrence Chung-Lai Lei
Life of this patent
Estimating the term…
Abstract
A system for wafer processing, includes: a frame comprising a frame opening; and a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening; wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame; and wherein the membrane opening area is less than a total area of the wafer.
Claims25
A system for processing a wafer, the system comprising:
- a frame comprising a frame opening extending through a frame thickness of the frame;
- and
- a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane thickness and a membrane opening extending through the membrane thickness, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening;
- wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame;
- and
- wherein the membrane opening area is less than a total area of the wafer.
3 more elements
A system for processing a wafer, the system comprising:
- a frame comprising a frame opening;
- and
- a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening;
- wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame;
- wherein the membrane opening area is less than a total area of the wafer;
- and
- wherein the membrane is under tension when the membrane is coupled to the frame.
4 more elements
A system for processing a wafer, the system comprising:
- a frame comprising a frame opening;
- and
- a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening;
- wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame;
- wherein the membrane opening area is less than a total area of the wafer;
- and
- wherein the membrane comprises an additional membrane opening, wherein the membrane is configured to couple with an additional wafer so that the additional wafer covers the additional membrane opening.
4 more elements
A system for processing a wafer, the system comprising:
- a frame comprising a frame opening;
- and
- a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening;
- wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame;
- wherein the membrane opening area is less than a total area of the wafer;
- and
- wherein the frame comprises a plasma resistant coating.
4 more elements
A system for processing a wafer, the system comprising:
- a frame comprising a frame opening;
- and
- a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening;
- wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame;
- wherein the membrane opening area is less than a total area of the wafer;
- and
- wherein the system further comprises a first isolation grid disposed on a first surface of the membrane, and a second isolation grid disposed on a second surface of the membrane, wherein the second surface of the membrane is opposite from the first surface of the membrane.
4 more elements
A solar cell assembly, comprising:
- a first module having a first substrate with a first surface and a second surface opposite the first surface, the first module also having a first conductive wire disposed over the first surface of the first substrate, and a second conductive wire disposed over the second surface of the first substrate;
- a second module having a second substrate with a first surface and a second surface opposite the first surface, the second module also having a first conductive wire disposed over the first surface of the second substrate, and a second conductive wire disposed over the second surface of the second substrate;
- and
- a membrane comprising a first membrane opening extending through a membrane thickness, and a second membrane opening extending through the membrane thickness, wherein the first substrate and the second substrate are coupled to a first surface of the membrane, wherein the first substrate covers the first membrane opening, and wherein the second substrate covers the second membrane opening;
- wherein the membrane comprises a through hole at a location that is between the first substrate and the second substrate;
- and
- wherein the first conductive wire of the first module is electrically connected to the second conductive wire of the second module via a conductor located in the through hole of the membrane.
4 more elements
A solar cell assembly, comprising:
- a first module having a first membrane with a first membrane opening, and a first substrate covering the first membrane opening, wherein the first substrate has a first surface and a second surface opposite the first surface, wherein the first module also has a first conductive wire disposed over the first surface of the first substrate, and a second conductive wire disposed over the second surface of the first substrate;
- and
- a second module having a second membrane with a second membrane opening, and a second substrate covering the second membrane opening, wherein the second substrate has a first surface and a second surface opposite the first surface, wherein the second module also has a first conductive wire disposed over the first surface of the second substrate, and a second conductive wire disposed over the second surface of the second substrate;
- wherein a part of the first conductive wire of the first module extends beyond an edge of the first substrate, and is located on the first membrane;
- wherein a part of the second conductive wire of the second module extends beyond an edge of the second substrate, and is located on the second membrane;
- and
- wherein a part of the second membrane overlaps a part of the first membrane, so that the first conductive wire of the first module is electrically coupled to the second conductive wire of the second module.
4 more elements
Dependencies are inferred from the claim text.