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US 11,894,474 B2Granted
Silicon photonic integrated lens compatible with wafer processing
AssigneeIntel Corporation
InventorsPriyanka Dobriyal, Ankur Agrawal, Susheel Jadhav, Quan Tran, Raghuram Narayan, Raiyomand Aspandiar, Kenneth Brown, John Heck
Life of this patent
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Abstract
Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.
Claims11
A semiconductor die, comprising:
- a semiconductor substrate having a first surface and a second surface;
- a first lens and a second lens over the first surface, the second lens laterally spaced apart from the first lens;
- and
- an optically transparent layer over the first lens and the second lens, wherein a first surface of the optically transparent layer is conformal to a surface of the first lens and the second lens and to the first surface of the semiconductor substrate, and wherein a second surface of the optically transparent layer is substantially flat over the first lens and the second lens and between the first lens and the second lens, the second surface opposite the first surface.
1 more element
A semiconductor die, comprising:
- a semiconductor substrate having a first surface and a second surface;
- a lens over the first surface;
- and
- an optically transparent layer over the lens, wherein the optically transparent layer comprises a polymer comprising poly (para-xylylene) or structural analogs thereof.
1 more element
Dependencies are inferred from the claim text.