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US 11,894,473 B2Granted
Sensing module and manufacturing method thereof
AssigneeChu Hua Chang
InventorsRuei Chi Chen, Chih Lin Yang
Life of this patent
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Abstract
The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.
Claims10
A method for manufacturing a sensing module, comprising:
- providing a substrate;
- disposing or forming a sensor on a first surface of the substrate;
- disposing at least one colloid on the first surface to surround the sensor;
- disposing an optical conversion element on the substrate and bonding at least one colloid with a lower edge of the optical conversion element, forming a hermetic chamber between the optical conversion element and the substrate;
- and
- using a light source to irradiate a second surface of the substrate, making a plurality of light rays of the light source penetrates the substrate to irradiate and solidify the at least one colloid;
- wherein a material of the substrate is selected from a group of acrylic, glass, sapphire, and silicon;
- the material of optical conversion element is selected from a group of silicon, germanium and zinc sulfide.
5 more elements
A sensing module, which includes:
- a substrate, disposing a printed circuit thereon, wherein a material of the substrate is selected from a group of acrylic, glass, sapphire and silicon;
- a material of optical conversion element is selected from a group of silicon, germanium and zinc sulfide;
- a sensor, disposed on a first surface of the substrate, and electrically connected with the printed circuit;
- at least one colloid, disposed on the first surface of the substrate to surround the sensor;
- and
- an optical conversion element, disposed on the first surface of the substrate and bonded with the at least one colloid with a lower edge thereof to form a hermetic chamber between the optical conversion element and the substrate.
3 more elements
Dependencies are inferred from the claim text.