Back side illumination image sensors and electronic device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYun Ki Lee, Jong Hoon Park, Jun Sung Park
Life of this patent
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Abstract
In some example embodiments, a back side illumination (BSI) image sensor may include a pixel configured to generate electrical signals in response to light incident on a back side of a substrate. In some example embodiments, the pixel includes, a photodiode, a device isolation film adjacent to the photodiode, a dark current suppression layer above the photodiode, a light shield grid above the photodiode and including an opening area of 1 to 15% of an area of the pixel, a light shielding filter layer above the light shield grid, a planarization layer above the light shielding filter layer, a lens above the planarization layer, and/or an anti-reflective film between the photodiode and the lens.
Claims20
An image sensor comprising:
- a substrate;
- a photodiode in the substrate;
- a light shield grid on the photodiode;
- a light shielding filter layer formed above the light shield grid, the light shielding filter layer including an opening above the photodiode;
- a planarization layer formed above the light shielding filter layer;
- and
- an anti-reflection film, including a plurality of sub-films on and planar to the planarization layer;
- wherein the plurality of sub-films comprises a stack including at least a first sub-film and a second sub-film.
An electronic device including image sensor, the image sensor comprising:
- a substrate;
- a photodiode in the substrate;
- a light shield grid on the photodiode;
- a light shielding filter layer formed above the light shield grid, the light shielding filter layer including an opening above the photodiode;
- a planarization layer formed above the light shielding filter layer;
- an anti-reflection layer, including a plurality of sub-films on and planar to the planarization layer;
- and
- an organic light emitting diode panel on the plurality of sub-films;
- wherein the plurality of sub-films comprises a stack including at least a first sub-film and a second sub-film.
Dependencies are inferred from the claim text.