Imaging apparatus and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorSusumu Hogyoku
Life of this patent
Estimating the term…
Abstract
Provided are an imaging apparatus and an electronic device in which even if an image sensor is mounted on a wiring board, the wiring board on which the image sensor is mounted can be assembled to a housing with high accuracy. Provided is an imaging apparatus including a sensor chip and a wiring board having a glass base material. The imaging apparatus is joined to at least one of the sensor chip or the wiring board via a bump unit including a plurality of bumps, and each of the plurality of bumps is formed by conductive members having substantially the same composition.
Claims13
An imaging apparatus comprising:
- a sensor chip;
- a wiring board having a glass base material and a laminated wiring layer;
- and
- a protective member that protects the sensor chip, wherein:
- the sensor chip and the wiring board are joined via a bump unit including a plurality of bumps,
- the bump unit includes a first bump and a second bump,
- the first bump is formed on the sensor chip and the second bump is formed on the first bump before the sensor chip and the wiring board are joined,
- each of the plurality of bumps is formed by conductive members having substantially same composition, wherein
- an adhesive is arranged on the glass base material and the laminated wiring layer of the wiring board, and the glass base material and the laminated wiring layer of the wiring board are adhered to the protective member, and wherein
- the adhesive includes a first adhesive and a second adhesive such that the first adhesive is arranged on a side surface of the glass base material and is arranged up to the protective member, and
- the second adhesive is arranged between the glass base material and the protective member.
An imaging apparatus comprising:
- a sensor chip;
- a wiring board having a glass base material and a laminated wiring layer;
- and
- a protective member that protects the sensor chip, wherein:
- the sensor chip and the wiring board are joined via a bump unit including a plurality of bumps,
- the bump unit includes a first bump and a second bump,
- the first bump is formed on the sensor chip and the second bump is formed on the first bump before the sensor chip and the wiring board are joined, and
- an adhesive is arranged on the glass base material and the laminated wiring layer of the wiring board, and the glass base material and the laminated wiring layer of the wiring board are adhered to the protective member, and wherein
- the adhesive includes a first adhesive and a second adhesive such that the first adhesive is arranged on a side surface of the glass base material and is arranged up to the protective member, and
- the second adhesive is arranged between the glass base material and the protective member.
An electronic device comprising an imaging apparatus mounted, the imaging apparatus including:
- at least a sensor chip;
- a wiring board having a glass base material and a laminated wiring layer;
- and
- a protective member that protects the sensor chip, wherein:
- the sensor chip and the wiring board are joined via a bump unit including a plurality of bumps,
- the bump unit includes a first bump and a second bump,
- the first bump is formed on the sensor chip, the second bump is formed on the first bump before the sensor chip and the wiring board are joined,
- each of the plurality of bumps is formed by conductive members having substantially same composition, wherein
- an adhesive arranged on the glass base material and the laminated wiring layer of the wiring board, and the glass base material and the laminated wiring layer of the wiring board are adhered to the protective member, and wherein
- the adhesive includes a first adhesive and a second adhesive such that the first adhesive is arranged on a side surface of the glass base material and is arranged up to the protective member, and
- the second adhesive is arranged between the glass base material and the protective member.
Dependencies are inferred from the claim text.