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US 11,894,405 B2Granted
Image sensor package
AssigneeSamsung Electronics Co., Ltd.
InventorKyongsoon Cho
Life of this patent
Estimating the term…
Abstract
An image sensor package includes a package substrate; an image sensor chip disposed on the package substrate; a dam structure disposed on the image sensor chip and including a dam main body having an opening and a first light absorption layer disposed on an inner wall of the dam main body; a transparent substrate on the dam structure; and an encapsulant contacting the image sensor chip and an outer wall of the dam main body.
Claims19
An image sensor package comprising:
- a package substrate;
- an image sensor chip on the package substrate;
- a dam structure on the image sensor chip and comprising a dam main body having an opening and a first light absorption layer on an inner wall of the dam main body;
- a transparent substrate on the dam structure;
- and
- an encapsulant contacting the image sensor chip and an outer wall of the dam main body,
- wherein the dam structure further comprises a second light absorption layer on an upper surface of the dam main body, and
- wherein the second light absorption layer vertically overlaps the whole dam main body.
5 more elements
An image sensor package comprising:
- an image sensor chip including a sensing region including a plurality of unit pixels and an outer region around the sensing region;
- a transparent substrate on the image sensor chip;
- a dam structure disposed between the outer region of the image sensor chip and the transparent substrate and including a black pigment,
- a first adhesive layer disposed between the dam structure and the image sensor chip and attaching the dam structure to the image sensor chip;
- and
- a second adhesive layer disposed between the dam structure and the transparent substrate and attaching the dam structure to the transparent substrate.
3 more elements
An image sensor package comprising:
- an image sensor chip including a sensing region including a plurality of unit pixels and an outer region around the sensing region;
- a dam main body disposed on the outer region of the image sensor chip and including an opening;
- a package substrate disposed on the dam main body and including a through hole communicating with the opening of the dam main body;
- a transparent substrate disposed on the package substrate to cover the through hole of the package substrate;
- a wiring pattern extending in horizontal direction and embedded in the package substrate, the wiring pattern electrically connected to a first substrate pad and a second substrate pad, the first and second substrate pads formed on a lower surface of the package substrate;
- a connection pad formed on an upper surface of the image sensor chip;
- a connection conductor electrically connecting the connection page and the first substrate pad;
- an external connection terminal disposed on the second substrate pad and electrically connected to the second substrate pad;
- and
- a light absorption layer disposed on at least one of an inner wall of the dam main body defining the opening and an inner wall of the package substrate defining the through hole of the package substrate.
7 more elements
Dependencies are inferred from the claim text.