Semiconductor package and method for fabricating same

A semiconductor package comprising:

• a first package substrate including a first surface and a second surface opposite to each other;
• an image sensor chip mounted on the first surface of the first package substrate;
• a transparent substrate disposed on the image sensor chip;
• an attachment dam between the image sensor chip and the transparent substrate, the attachment dam extending along an edge of the image sensor chip to define a gap between the image sensor chip and the transparent substrate;
• a first molding layer on the first surface of the first package substrate, the first molding layer being spaced apart from the image sensor chip and surrounding a side surface of the image sensor chip;
• and
• a second molding layer on the first surface of the first package substrate, the second molding layer filling a space between the image sensor chip and the first molding layer,
• wherein a side surface of the first molding layer facing the second molding layer forms an acute angle with the first surface of the first package substrate, and
• the side surface of the first molding layer including a plurality of inner edge recesses, and a side surface of the second molding layer including a plurality of protrusions that respectively extend into the plurality of inner edge recesses.

A semiconductor package comprising:

• a package substrate;
• a semiconductor chip mounted on the package substrate;
• a transparent substrate disposed on the semiconductor chip;
• an attachment dam between the semiconductor chip and the transparent substrate, the attachment dam extending along an edge of the semiconductor chip to define a gap between the semiconductor chip and the transparent substrate;
• a first molding layer on the package substrate, the first molding layer surrounding a side surface of the semiconductor chip;
• and
• a second molding layer on the package substrate, the second molding layer filling a space between the semiconductor chip and the first molding layer,
• wherein a coefficient of thermal expansion (CTE) of the second molding layer is smaller than that of the first molding layer, and
• wherein the first molding layer includes a first epoxy resin composition having a first thixotropic index, the second molding layer includes a second epoxy resin composition having a second thixotropic index, and the first thixotropic index is greater than the second thixotropic index.