Trench capacitor assembly for high capacitance density
AssigneeQUALCOMM Incorporated
InventorsJonghae Kim, Milind Shah, Periannan Chidambaram
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Abstract
Certain aspects of the present disclosure provide a capacitor assembly, a stacked capacitor assembly, an integrated circuit (IC) assembly comprising such a stacked capacitor assembly, and methods for fabricating the same. One exemplary capacitor assembly generally includes a first array of trench capacitors and a second array of trench capacitors. The second array of trench capacitors may be disposed adjacent to and electrically coupled to the first array of trench capacitors. Additionally, the second array of trench capacitors may be inverted with respect to the first array of trench capacitors.
Claims8
A stacked capacitor assembly comprising a plurality of capacitor assemblies stacked vertically and electrically coupled together, wherein at least one of the plurality of capacitor assemblies comprises a first capacitor assembly, the first capacitor assembly comprising:
- a first array of trench capacitors;
- and
- a second array of trench capacitors disposed adjacent to and electrically coupled to the first array of trench capacitors, the second array of trench capacitors being inverted with respect to the first array of trench capacitors.
A method of fabricating a capacitor assembly, the method comprising:
- forming a first array of trench capacitors;
- forming a second array of trench capacitors;
- inverting the second array of trench capacitors;
- disposing the inverted second array of trench capacitors adjacent to the first array of trench capacitors;
- and
- electrically coupling the first array of trench capacitors to the inverted second array of trench capacitors.
Dependencies are inferred from the claim text.