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US 11,894,356 B2Granted
Chip having multiple functional units and semiconductor structure using the same
AssigneeMacronix International Co., Ltd.
InventorShih-Hung Chen
Life of this patent
Estimating the term…
Abstract
A chip includes a substrate and a plurality of functional units on the substrate, in which each of the functional units has its own set of pads. The functional units are physically connected and there is no scribe line passes through the chip. A semiconductor structure having the chip is also disclosed.
Claims19
A chip, comprising:
- a substrate;
- and
- a plurality of functional units on the substrate, wherein each of the functional units has its own set of pads, the set of pads of each of the functional units comprise I/O pads, power pads, and ground pads, wherein each of the functional units is configured to be individually controlled.
A semiconductor structure, comprising:
- a chip comprising a substrate and a plurality of functional units on the substrate, wherein the functional units comprise normal functional units and at least one failed functional unit wherein each of the functional units has its own set of pads, the set of pads of each of the functional units comprise I/O pads, power pads, and ground pads, wherein each of the functional units is configured to be individually controlled;
- and
- a plurality of chiplets bonded on the normal functional units, respectively.
A semiconductor structure, comprising:
- a lower chip comprising a first substrate, a plurality of first functional units and a central manage unit on the first substrate;
- and
- an upper chip comprising a second substrate and a plurality of second functional units on the second substrate, wherein each of the first and second functional units has its own set of pads, the set of pads of each of the functional units comprise I/O pads, power pads, and ground pads, wherein each of the functional units is configured to be individually controlled.
Dependencies are inferred from the claim text.