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US 11,894,354 B2Granted
Optoelectronic device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChi-Han Chen
Life of this patent
Estimating the term…
Abstract
An optoelectronic device package includes a first redistribution layer (RDL), a first electronic die disposed over the first RDL, wherein an active surface of the first electronic die faces the first RDL. The optoelectronic device package further includes a second electronic die disposed over the first RDL, and a photonic die disposed over and electrically connected to the second electronic die. An active surface of the second electronic die is opposite to the first RDL.
Claims16
An optoelectronic device package, comprising:
- a first redistribution layer (RDL);
- a processing die;
- and
- an input/output (I/O) die,
- wherein the processing die and the I/O die are electrically connected to each other through the first RDL, the processing die comprises an active surface and an opposing surface opposite to the active surface, the I/O die includes an active surface and an opposing surface opposite to the active surface, the active surface of the processing die and the active surface of the I/O die are closer to the first RDL than the opposing surface of the processing die and the opposing surface of the I/O die;
- and
- an electronic integrated circuit (EIC) die arranged on the first RDL, wherein the EIC die includes an active surface and an opposing surface, and the active surface of the EIC die is farther from the first RDL than the opposing surface of the EIC die,
- wherein the I/O die is disposed between the processing die and the EIC die, and an edge of the first RDL protrudes out of an outer edge of the EIC die from a top view in a direction away from the I/O die.
5 more elements
An optoelectronic device package, comprising:
- a first redistribution layer (RDL);
- a first electronic die disposed over the first RDL, wherein an active surface of the first electronic die faces the first RDL;
- a second electronic die disposed over the first RDL, wherein an active surface of the second electronic die is opposite to the first RDL;
- a photonic die disposed over and electrically connected to the second electronic die;
- a second RDL under the first electronic die and the second electronic die, and the second RDL is connected to the active surface of the first electronic die;
- and
- a third RDL over the first electronic die and the second electronic die, and the third RDL is electrically connected to the active surface of the second electronic die.
4 more elements
An optoelectronic device package, comprising:
- a first redistribution layer (RDL);
- a processing die;
- and
- an input/output (I/O) die,
- wherein the processing die and the I/O die are electrically connected to each other through the first RDL, the processing die comprises an active surface and an opposing surface opposite to the active surface, the I/O die includes an active surface and an opposing surface opposite to the active surface, the active surface of the processing die and the active surface of the I/O die are closer to the first RDL than the opposing surface of the processing die and the opposing surface of the I/O die;
- and
- an electronic integrated circuit (EIC) die arranged on the first RDL, wherein the EIC die includes an active surface and an opposing surface, and the active surface of the EIC die is farther from the first RDL than the opposing surface of the EIC die, and wherein the opposing surface of the EIC die, the active surface of the processing die and the active surface of the I/O die are misaligned with each other.
4 more elements
Dependencies are inferred from the claim text.