Driving substrate and manufacturing method thereof, and micro LED bonding method

A manufacturing method of a driving substrate, comprising:

• providing a base substrate;
• forming a driving function layer on the base substrate, the driving function layer comprising a plurality of driving thin film transistors and a plurality of common electrode lines;
• forming a pad layer on a side of the driving function layer away from the base substrate, the pad layer comprising a plurality of first pads and a plurality of second pads, each of the first pads being connected to a first electrode of a corresponding driving thin film transistor, each of the second pads being connected to a corresponding common electrode line, the first pad and the second pad each comprising a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate, wherein the microstructure is provided to be inserted into a micro LED and in contact with the micro LED;
• and
• forming a plurality of buffer structures on the side of the driving function layer away from the base substrate, wherein each of the buffer structures surrounds a portion of a corresponding microstructure close to the base substrate, an upper surface of the buffer structures is parallel with the upper surface of the driving function layer, and a height of the upper surface of the buffer structure exceeds a height of the pad body and is lower than a height of the microstructures;
• wherein each buffer structure is formed in contact with a microstructure, every two adjacent pads are spaced by a first interval, and a second interval exists between the buffer structures corresponding to two adjacent pads, wherein the orthogonal projection of the first interval on the base substrate overlaps with the orthogonal projection of the second interval on the base substrate.