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US 11,894,345 B2Granted
Integrated voltage regulator and passive components
AssigneeAdeia Semiconductor Inc.
InventorsJavier A DeLaCruz, Don Draper, Belgacem Haba, Ilyas Mohammed
Life of this patent
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Abstract
It is highly desirable in electronic systems to conserve space on printed circuit boards (PCB). This disclosure describes voltage regulation in electronic systems, and more specifically to integrating voltage regulators and associated passive components into semiconductor packages with at least a portion of the circuits whose voltage(s) they are regulating.
Claims22
A method of making a semiconductor package, the method comprising:
- providing a first die substrate having formed thereon a first circuit, the first circuit comprising a first portion of a passive component, the passive component selected from the group consisting of:
- a capacitor, an inductor, a resistor, a fuse, and an antifuse;
- providing a second die substrate having formed thereon a second circuit, the second circuit comprising a second portion of the passive component;
- and
- coupling the first portion of the passive component to the second portion of the passive component to complete the passive component functionally coupled to one or both of the first circuit and the second circuit.
2 more elements
A method comprising:
- forming a package substrate comprising a first side and a second side opposite the first side;
- coupling a first side of a first semiconductor die to the second side of the package substrate;
- coupling a first bonding layer to a second side of the first semiconductor die opposite the first side of the first semiconductor die;
- coupling a second bonding layer to a first side of a second semiconductor die;
- forming a circuit comprising at least one active component on the first semiconductor die or the second semiconductor die;
- integrating a first portion of a first passive component into the first semiconductor die;
- integrating a second portion of the first passive component into the second semiconductor die;
- electrically coupling the first portion or the second portion of the first passive component to the circuit;
- and
- completing the first passive component by coupling the second side of the first semiconductor die to the first side of the second semiconductor die.
7 more elements
A method of forming a semiconductor package, the method comprising:
- providing a first semiconductor die having formed thereon a circuit comprising at least one active component;
- the first semiconductor die having further formed thereon a first portion of a passive component;
- providing a second semiconductor die having formed thereon a second portion of the passive component;
- electrically coupling the first portion or the second portion of the passive component to the voltage regulator circuit;
- and
- completing the passive component by electrically coupling the first portion of the passive component to the second portion of the passive component by physically bonding the first semiconductor die to the second semiconductor die.
3 more elements
Dependencies are inferred from the claim text.