Vertical semiconductor device with side grooves
AssigneeWestern Digital Technologies, Inc.
InventorsXianlu Cui, Junrong Yan, Wei Liu, Zhonghua Qian
Life of this patent
Estimating the term…
Abstract
A semiconductor device is vertically mounted on a medium such as a printed circuit board (PCB). The semiconductor device comprises a block of semiconductor dies, mounted in a vertical stack without offset. Once formed and encapsulated, side grooves may be formed in the device exposing electrical conductors of each die within the device. The electrical conductors exposed in the grooves mount to electrical contacts on the medium to electrically couple the semiconductor device to the medium.
Claims17
A semiconductor device configured to mount to a medium, the semiconductor device comprising:
- a plurality of semiconductor dies, each semiconductor die comprising:
- a first major surface and a second major surface,
- a die attach film (DAF) on the first major surface, and
- metal pillars extending from the second major surface, adjacent an edge of the semiconductor die, wherein the metal pillars on a first semiconductor die of the plurality of semiconductor dies are buried in the DAF of a second semiconductor die of the plurality of semiconductor dies next adjacent the first semiconductor die;
- the plurality of semiconductor dies configured to surface mount to the medium with the edge of each semiconductor die facing the medium, the metal pillars configured to couple with electrical contacts on the medium.
A semiconductor device, comprising:
- a plurality of stacked semiconductor dies, each semiconductor die comprising:
- a first major surface having a length and a width,
- a second major surface having a length and a width corresponding to the length and the width of the first major surface,
- an edge extending between the first and second major surfaces,
- metal pillars formed on the first major surface adjacent the edge of the semiconductor die, and
- die attach film (DAF) on the second major surface for affixing the second major surface to another surface, the plurality of semiconductor dies stacked in a block, separated by the DAF;
- grooves formed in a side of the block, the grooves exposing the metal pillars;
- and
- molding compound encapsulating the plurality of semiconductor dies, at least one of the grooves formed through a surface of the molding compound.
A semiconductor device, comprising:
- a plurality of stacked semiconductor dies, each semiconductor die comprising:
- a first major surface having a length and a width,
- a die attach film (DAF) on the first major surface,
- a second major surface having a length and a width corresponding to the length and the width of the first major surface,
- an edge extending between the first and second major surfaces,
- electrical conductor means extending from the first major surface adjacent the edge of the semiconductor die and buried in the DAF on the first major surface, the plurality of semiconductor dies stacked in a block;
- and
- grooves formed in a side of the block, the grooves exposing the electrical conductor means.
Dependencies are inferred from the claim text.