Integrated fan-out package and manufacturing method thereof

An integrated fan-out (InFO) package, comprising:

• a die;
• a plurality of conductive structures aside the die;
• an encapsulant laterally encapsulating the die and the plurality of conductive structures;
• and
• a redistribution structure disposed on the encapsulant, wherein the redistribution structure comprises:
• a first dielectric layer;
• a second dielectric layer stacked on the first dielectric layer;
• a first alignment mark embedded in the first dielectric layer, wherein the first alignment mark comprises a first seed layer and a plurality of first conductive patterns, the plurality of first conductive patterns are stacked on the first seed layer, and the first alignment mark is electrically insulated from the die and the plurality of conductive structures;
• and
• a second alignment mark embedded in the second dielectric layer, wherein the second alignment mark comprises a second seed layer, a second conductive pattern, and a plurality of third conductive patterns, the second conductive pattern is sandwiched between the second seed layer and the plurality of third conductive patterns, and the second alignment mark is electrically insulated from the die and the plurality of conductive structures.

A manufacturing method of an integrated fan-out (InFO) package having an active region and a border region surrounding the active region, comprising:

• forming a first redistribution structure;
• forming a plurality of conductive structures on the first redistribution structure;
• placing a die between the plurality of conductive structures;
• laterally encapsulating the die and the plurality of conductive structures by an encapsulant;
• and
• forming a second redistribution structure over the encapsulant, comprising:
• forming a first sub-layer over the encapsulant, the die, and the plurality of conductive structures, wherein the first sub-layer comprises a plurality of first conductive vias and a first alignment mark, the plurality of first conductive vias is located in the active region and the first alignment mark is located in the border region, and the first alignment mark is physically in contact with the encapsulant;
• and
• forming a second sub-layer over the first sub-layer, wherein the second sub-layer comprises a plurality of routing patterns, a plurality of second conductive vias, and a second alignment mark, the plurality of routing patterns and the plurality of second conductive vias are located in the active region and the second alignment mark is located in the border region, the first alignment mark and the second alignment mark are vertically offset from each other in the same border region, and the border region is devoid of the die, the plurality of routing patterns, the plurality of first conductive vias, and the plurality of second conductive vias.