Back to results
US 11,894,334 B2Granted
Dual head capillary design for vertical wire bond
AssigneeIntel Corporation
InventorsYuhong Cai, Bilal Khalaf, Yi Xu
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.
Claims10
A wire bond, comprising:
- a first attachment ball attached to a first surface of a first substrate;
- a first wire having a first portion contacting the first attachment ball and a second portion, the first wire having a sidewall between first and second opposite ends;
- a second attachment ball attached to a first surface of a second substrate, the first surface of the second substrate having a face-to-face orientation with the first surface of the first substrate;
- and
- a second wire having a first portion contacting the second attachment ball and a second portion, the second wire having a sidewall between first and second opposite ends, wherein the sidewall of the second portion of the first wire vertically overlaps with and is connected to and in direct physical contact with the sidewall of the second portion of the second wire.
2 more elements
Dependencies are inferred from the claim text.