Semiconductor package

A semiconductor package comprising:

• a semiconductor chip including a connection pad;
• and
• a redistribution substrate including a redistribution pad electrically connected to the connection pad, a space pattern separating at least some of the redistribution pads from each other, a dummy metal pattern disposed on same level as the redistribution pad and at least partially surrounded by the space pattern, a redistribution layer disposed on a different level from the redistribution pad, and a connection via connecting the redistribution pad and the redistribution layer to each other,
• wherein an external surface of the redistribution pad has a concave-convex shape.

A semiconductor package comprising:

• a redistribution substrate including a connection via and a redistribution layer electrically connected to each other, and a redistribution pad electrically connected to the redistribution layer by the connection via, a space pattern separating at least some of the redistribution pads from each other, a dummy metal pattern at least partially surrounded by the space pattern, and a degassing opening passing through at least one of the redistribution pad and the dummy metal pattern;
• a connection bump electrically connected to the redistribution pad;
• and
• a semiconductor chip disposed on the redistribution substrate and including a connection pad electrically connected to the redistribution layer,
• wherein the redistribution pad includes a plurality of protrusions protruding from a same plane in directions different to each other based on a center thereof and having a corner having a rounded shape, and
• wherein the dummy metal pattern includes branch patterns each extending in four directions different from one another.