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US 11,894,327 B2Granted
Apparatus including integrated segments and methods of manufacturing the same
AssigneeMicron Technology, Inc.
InventorsWei Zhou, Chien Wen Huang
Life of this patent
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Abstract
Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide warpage control for the corresponding semiconductor device.
Claims13
An apparatus, comprising:
- a semiconductor substrate;
- a passivation layer over a surface of the semiconductor substrate;
- and
- an interfacing segment patterned within the passivation layer, wherein
- the interfacing segment includes electrical isolative material,
- the interfacing segment having a bottom surface that is above the semiconductor substrate,
- the interfacing segment and the passivation layer include different material, and
- the interfacing segment and the passivation layer are coplanar with each other.
5 more elements
Dependencies are inferred from the claim text.