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US 11,894,325 B2Granted
Semiconductor device having a resin that seals a rewiring
AssigneeRohm Co., Ltd.
InventorManato Kurata
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor layer that has a main surface, an electrode pad that is formed on the main surface, a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad, and a resin that covers the second wiring surface on the main surface and that seals the rewiring.
Claims27
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- an underlayer that is formed on the main surface and that has an opening by which the electrode pad is exposed;
- a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being connected to the electrode pad in the opening and being drawn out from the opening onto the underlayer;
- a post electrode connected to the second wiring surface;
- a resin that covers the second wiring surface on the main surface and that seals both the rewiring and the post electrode such as to expose a part of the post electrode;
- and
- an underlayer recess formed at a part exposed from the rewiring in the underlayer.
5 more elements
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad;
- and
- a resin that covers the second wiring surface on the main surface and that seals the rewiring;
- wherein the resin includes a matrix resin and a plurality of fillers that are added to the matrix resin and that are respectively non-uniform in diameter.
3 more elements
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- a rewiring that is connected to the electrode pad and that is formed on the main surface such as to be drawn out to a region outside the electrode pad;
- a post electrode having a first electrode surface connected to the rewiring, a second electrode surface positioned on a side opposite to the first electrode surface, and an electrode lateral surface that connects the first electrode surface and the second electrode surface together and that is roughened;
- and
- a resin that exposes the second electrode surface on the main surface and that seals the rewiring and the post electrode such as to cover the electrode lateral surface.
3 more elements
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- an underlayer that is formed on the main surface and that has an opening by which the electrode pad is exposed;
- a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being connected to the electrode pad in the opening and being drawn out from the opening onto the underlayer;
- a resin that covers the second wiring surface on the main surface and that seals the rewiring;
- and
- an underlayer recess formed at a part exposed from the rewiring in the underlayer.
4 more elements
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad;
- a post electrode connected to the second wiring surface;
- and
- a resin that covers the second wiring surface on the main surface and that seals both the rewiring and the post electrode such as to expose a part of the post electrode.
3 more elements
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad;
- a post electrode connected to the second wiring surface;
- and
- a resin that covers the second wiring surface on the main surface and that seals both the rewiring and the post electrode such as to expose a part of the post electrode.
3 more elements
A semiconductor device comprising:
- a semiconductor layer that has a main surface;
- an electrode pad that is formed on the main surface;
- a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad;
- a post electrode connected to the second wiring surface;
- and
- a resin that covers the second wiring surface on the main surface and that seals both the rewiring and the post electrode such as to expose a part of the post electrode.
3 more elements
Dependencies are inferred from the claim text.