In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same

An electronic package comprising:

• a package substrate;
• a first silicon chip and a second silicon chip attached to the package substrate;
• a multi-layer waveguide structure formed in the package substrate, the multi-layer waveguide structure interconnecting the first silicon chip and second silicon chip, wherein the multi-layer waveguide structure includes a first waveguide and a second waveguide interconnecting the first silicon chip and the second silicon chip, wherein the first waveguide is vertically beneath the second waveguide;
• and
• a conductive interconnect in the package substrate, the conductive interconnect interconnecting the first silicon chip with the second silicon chip.

A device comprising:

• a substrate;
• and
• a first stacked die including a plurality of dies attached to the substrate;
• a second stacked die including a plurality of dies attached to the substrate;
• a first waveguide formed in the substrate to interconnect the first stacked die and the second stacked die;
• a second waveguide formed in the substrate to interconnect the first stacked die and the second stacked die, wherein the second waveguide is vertically beneath the first waveguide;
• and
• a conductive interconnect in the substrate, the conductive interconnect interconnecting the first stacked die with the second stacked die.

A computing system comprising:

• input and output devices;
• and
• at least one integrated circuit die;
• the integrated circuit die includes a substrate and at least two die areas interconnected by a first waveguide in the substrate and by a second waveguide in the substrate, the second waveguide vertically beneath the first waveguide, and the at least two die areas further interconnected by a conductive interconnect in the substrate.