Launch structures for radio frequency integrated device packages

A laminate substrate for supporting a radio frequency (RF) integrated device die configured to operate at one or more operational frequencies, the laminate substrate having a front side and a back side opposite the front side, the laminate substrate comprising:

• a bump launch structure defined at least in part by one or more layers at or near the front side of the laminate substrate, the bump launch structure comprising metallic and insulating materials arranged in a first pattern having a first impedance at the one or more operational frequencies, the first impedance of the bump launch structure configured to substantially match an impedance of the RF integrated device die having radio frequency (RF) circuitry;
• a ball launch structure defined at least in part by one or more layers at or near the back side of the laminate substrate, the ball launch structure comprising metallic and insulating materials arranged in a second pattern having a second impedance at the one or more operational frequencies, the second impedance of the ball launch structure configured to substantially match an impedance of a system board;
• and
• one or more traces or vias that electrically connect the bump launch structure and the ball launch structure, the vias extending along a direction transverse to a major lateral dimension of the laminate substrate,
• wherein at least one of the first pattern of the bump launch structure and the second pattern of the ball launch structure comprises a metallic trace connected to the vias and extending generally parallel to the major lateral dimension of the laminate substrate for transferring signals laterally and comprising at least two turns and a variable width portion along at least a portion of a length of at least one of the first pattern of the bump launch structure and the second pattern of the ball launch structure, the variable width portion of the metallic trace disposed in a same plane as the at least two turns, wherein the variable width portion is positioned between the at least two turns and the via, and wherein the variable width portion is positioned adjacent to a location at which the metallic trace connects to the via, and
• wherein the vias are spaced apart by a variable pitch.

An electronic device comprising:

• a system board having a first radio frequency (RF) communications line, the first RF communications line having a first impedance at one or more operational frequencies;
• a laminate substrate mounted to the system board, the laminate substrate having a front side and a back side opposite the front side;
• a plurality of solder balls disposed between the system board and the back side of the laminate substrate, the solder balls electrically connecting the system board and the laminate substrate;
• and
• a ball launch structure defined at least in part by one or more layers at or near the back side of the laminate substrate, the ball launch structure comprising metallic and insulating materials arranged in a first pattern having a second impedance at the one or more operational frequencies, the second impedance of the ball launch structure matched to the first impedance of the first RF communications line such that a voltage standing wave ratio (VSWR) of the ball launch structure is less than 5:1,
• wherein the first pattern of the ball launch structure comprises a metallic trace extending generally parallel to a major lateral dimension of the laminate substrate for transferring signals laterally and comprising at least two turns and a variable with portion along at least a portion of a length of the first pattern of the ball launch structure, the variable width portion of the metallic trace disposed in a same plane as the at least two turns, wherein the variable width portion is positioned between the at least two turns and a conductive via, and wherein the variable width portion is positioned adjacent to a location at which the metallic trace connects to the conductive via.