Semiconductor device package with stress reduction design and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Shen Yeh, Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng
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Abstract
A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, a semiconductor device, a ring structure, a lid structure, and an adhesive member. The semiconductor device is disposed over the substrate. The ring structure is disposed over the substrate and surrounds the semiconductor device. The lid structure is disposed over the ring structure and extends across the semiconductor device. The adhesive member is disposed in a gap between the ring structure and the semiconductor device and attached to the lid structure and the substrate.
Claims20
A semiconductor device package, comprising:
- a substrate having a first surface;
- a semiconductor device disposed over the first surface;
- a ring structure disposed over the first surface and surrounding the semiconductor device;
- a lid structure disposed over a top surface of the ring structure and extending across the semiconductor device;
- and
- an adhesive member disposed in a gap between the ring structure and the semiconductor device and attached to the lid structure and the first surface, wherein the adhesive member is separated from the semiconductor device and the ring structure.
A semiconductor device package, comprising:
- a substrate having a first surface;
- a semiconductor device disposed over the first surface;
- a ring structure disposed over the first surface and surrounding the semiconductor device;
- a lid structure disposed over a top surface of the ring structure and extending across the semiconductor device;
- and
- a plurality of adhesive members separated from each other and disposed in a gap between the ring structure and the semiconductor device, wherein the adhesive members extend from the first surface of the substrate to the lid structure to connect the lid structure to the substrate.
A method for forming a semiconductor device package, comprising:
- attaching a semiconductor device to a first surface of a substrate;
- mounting a ring structure on the first surface to surround the semiconductor device, wherein the ring structure comprises a first ring part and a second ring part on opposite sides of the semiconductor device, a first gap is formed between the first ring part and the semiconductor device, a second gap is formed between the second ring part and the semiconductor device, and the first gap is smaller than the second gap;
- mounting a lid structure on a top surface of the ring structure to cover the semiconductor device;
- and
- providing at least one adhesive member in the first gap to connect the lid structure to the substrate.
Dependencies are inferred from the claim text.