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US 11,894,319 B2Granted
Extended seal ring structure on wafer-stacking
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Hsorng Shen, Kuan-Hsien Lee
Life of this patent
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Abstract
Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers, or combinations thereof.
Claims20
A method comprising:
- bonding first connectors of a first wafer to second connectors of a second wafer, the first wafer comprising a first seal ring, the second wafer comprising a second seal ring;
- forming a third seal ring surrounding the first connectors and the second connectors, the third seal ring spanning an interface between the first wafer and the second wafer, the third seal ring comprising a first seal ring extension extending from the first seal ring and a second seal ring extension extending from the second seal ring;
- forming a trench through the second wafer, the trench penetrating the first wafer, the trench surrounding the first connectors and the second connectors;
- filling the trench with a seal ring material to form a fourth seal ring;
- and
- singulating the first wafer and the second wafer to singulate a first package therefrom.
3 more elements
A method comprising:
- forming a first trench in an upper surface of a first workpiece, the first trench exposing a first seal ring of the first workpiece;
- depositing a first conductive material in the first trench to form a first seal ring extension, the first seal ring extension extending continuously from a first interface with the first seal ring to an upper surface of the first workpiece;
- forming a second trench in an upper surface of a second workpiece, the second trench exposing a second seal ring of the second workpiece;
- depositing a second conductive material in the second trench to form a second seal ring extension, the second seal ring extension extending continuously from a second interface with the first seal ring to an upper surface of the second workpiece;
- bonding the first workpiece to the second workpiece and the first seal ring extension to the second seal ring extension to form a third interface between the first seal ring extension and the second seal ring extension and to form an air gap between the first workpiece and the second workpiece, the air gap extending horizontally between an upper surface of the first workpiece and an upper surface of the second workpiece, the air gap sealed by the third interface;
- and
- singulating a first package from the first workpiece and the second workpiece.
4 more elements
A method comprising:
- bonding a front side of a second wafer to a front side of a first wafer to form a wafer-on-wafer structure;
- forming a trench through the second wafer into the first wafer;
- filling the trench to form an extended seal ring;
- and
- singulating a first package from the wafer-on-wafer structure, the first package comprising:
- a first die and a second die, the a first die comprising a first seal ring surrounding a periphery thereof, the second die comprising a second seal ring surrounding a periphery thereof;
- the extended seal ring spanning between the first die and the second die, the extended seal ring surrounding a contact area of the wafer-on-wafer structure and sealing the contact area within the extended seal ring;
- and
- a contact pad disposed at an upper surface of the first package, the contact pad electrically coupled to the extended seal ring.
6 more elements
Dependencies are inferred from the claim text.