Containing electromagnetic interference radiation in lidless semiconductor packages

An electromagnetic interference absorber for a semiconductor package, the electromagnetic interference absorber comprising:

• a body portion configured to be provided on a first portion of a surface of a substrate that includes a semiconductor device provided on a second portion of the surface of the substrate and a stiffener plate provided on a third portion of the surface of the substrate,
• wherein the first portion, the second portion, and the third portion are separate,
• wherein the stiffener plate is configured to be spaced from and to surround the semiconductor device,
• wherein the body portion is configured to be provided between the semiconductor device and the stiffener plate;
• a main opening provided in the body portion and configured to receive the semiconductor device;
• and
• one or more openings to receive one or more corresponding components provided on the surface of the substrate between the stiffener plate and the electromagnetic interference absorber.

A semiconductor package, comprising:

• a substrate;
• an application-specific integrated circuit provided on a first portion of a surface of the substrate;
• a memory device provided on a second portion of the surface of the substrate;
• a stiffener plate provided on a third portion of the surface of the substrate,
• wherein the stiffener plate is configured to be spaced from and to surround the application-specific integrated circuit and the memory device;
• and
• an electromagnetic interference absorber provided on a fourth portion of the surface of the substrate,
• wherein the first portion, the second portion, third portion, and fourth portion are separate,
• wherein the electromagnetic interference absorber is configured to be provided between the stiffener plate and the application-specific integrated circuit and the memory device,
• wherein the electromagnetic interference absorber is configured to surround the application-specific integrated circuit and the memory device and to block electromagnetic interference radiation generated by the application-specific integrated circuit and the memory device, and
• wherein the electromagnetic interference absorber includes one or more openings to receive one or more corresponding components provided on the surface of the substrate between the stiffener plate and the electromagnetic interference absorber.