Semiconductor power module with busbar having a leg with a foot forming an offset angle, and method for manufacturing the busbar
AssigneeDanfoss Silicon Power GmbH
InventorMichael Tønnes
Life of this patent
Estimating the term…
Abstract
A conducting busbar (2, 4) suitable for use in a semiconductor power module (8) is provided. The busbar (2, 4) comprises a main plate (210, 410), one or more legs (220, 420) extending from the main plate (210, 410), and one or more feet (230, 430) formed at the free end of the legs (220, 420). According to the invention, the intersection line (L) between at least one of the legs (220, 420) and the associated foot (230, 430) forms an offset angle (α) with respect to the longitudinal direction (X) of the main plate (210, 410).
Claims21
A semiconductor power module comprising:
- a substrate comprising a circuit pattern;
- and
- a conducting busbar, the busbar comprising:
- a main plate,
- one or more legs extending from the main plate, each extending in a direction out of a plane of the main plate, and
- one or more feet formed at a free end of the legs,
- wherein an intersection line between at least one of the legs and the associated foot forms an offset angle with respect to a longitudinal direction of the main plate, and
- wherein at least one or more feet formed at the free end of the legs form a point of connection with the circuit pattern of the substrate.
A method for forming a conducting busbar, comprising the steps of:
- stamping or cutting a planar structure with a main plate and at least one leg out of an electrical conducting sheet;
- bending the at least one leg out of the plane of a main plate, and bending an end section of the at least one leg to form a foot;
- and
- twisting the at least one leg in such a way that an intersection line between the at least one leg and the associated foot forms an offset angle with respect to a longitudinal direction of the main plate.
Dependencies are inferred from the claim text.