Conductive traces in semiconductor devices and methods of forming same

A method for forming a semiconductor device comprising:

• forming a first insulating layer over a substrate, the substrate having a conductive feature;
• exposing a first portion and a second portion of the first insulating layer;
• exposing a third portion and a fourth portion of the first insulating layer, wherein the fourth portion overlaps the first portion;
• removing the first portion, the second portion, the third portion, and the fourth portion to form a first recess, a second recess, a third recess, and a fourth recess, respectively, wherein the fourth recess exposes the conductive feature, wherein the first recess, the second recess, and the third recess extends only partially through the first insulating layer;
• forming a conductive material in the first recess, the second recess, the third recess, and fourth recess to form a first conductive line in the first recess, a second conductive line in the second recess, a third conductive line in the third recess, and a conductive via in the fourth recess;
• and
• depositing a second insulating layer over the first insulating layer.

A method for forming a semiconductor device comprising:

• forming a first insulating layer over a substrate, the substrate having a conductive feature;
• removing portions of the first insulating layer to simultaneously form a first recess, a second recess, and a third recess in the first insulating layer, wherein bottom surfaces of the first recess, the second recess, and the third recess are a surface of the first insulating layer, wherein a depth of the first recess is different than a depth of the second recess;
• forming a conductive material in the first recess, the second recess, and the third recess to form a first conductive line in the first recess, a second conductive line in the second recess, and a third conductive line in the third recess, wherein the second conductive line comprises a signal line, wherein the first conductive line and the third conductive line comprise power/ground lines;
• and
• depositing a second insulating layer over the first insulating layer.