Integrated circuit package with heatsink

An integrated circuit package comprising:

• a substrate comprising a first surface and a second surface opposite the first surface;
• an integrated circuit coupled to the first surface of the substrate;
• a first plurality of signal conductors arranged along a periphery of the first surface of the substrate, the first plurality of signal conductors configured to connect a first plurality of wires to the integrated circuit;
• and
• a second plurality of signal conductors arranged along a periphery of the second surface of the substrate, the second plurality of signal conductors configured to connect a second plurality of wires to the integrated circuit, wherein the first plurality of signal conductors and the second plurality of signal conductors are configured to connect to twinaxial connectors.

An apparatus comprising:

• a heatsink;
• an integrated circuit positioned within the heatsink, wherein the heatsink defines a (i) channel along a length of the heatsink and (ii) an opening within the channel;
• and
• a first plurality of power bars positioned within the channel such that the first plurality of power bars extend along the length of the heatsink, wherein the first plurality of power bars are configured to deliver electrical power to the integrated circuit through the opening.