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US 11,894,293 B2Granted
Circuit structure and electronic structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen Hung Huang
Life of this patent
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Abstract
A circuit structure and an electronic structure are provided. The circuit structure includes a low-density conductive structure, a high-density conductive structure and an electrical connection structure. The high-density conductive structure is disposed on the low-density conductive structure. The electrical connection structure extends through the high-density conductive structure and is electrically connected to the low-density conductive structure. The electrical connection structure includes a shoulder portion.
Claims17
An electronic structure, comprising:
- a lower conductive structure;
- an upper conductive structure disposed on the lower conductive structure;
- an intermediate layer bonding the upper conductive structure and the lower conductive structure;
- an electrical connection structure electrically connecting the upper conductive structure and the lower conductive structure, wherein the electrical connection structure includes a shoulder portion located outside the lower conductive structure;
- and
- an electronic device disposed on the upper conductive structure, wherein the shoulder portion is closer to the upper conductive structure than the lower conductive structure is.
3 more elements
An electronic structure, comprising:
- a lower conductive structure;
- an upper conductive structure disposed over the lower conductive structure;
- an intermediate layer disposed between the upper conductive structure and the lower conductive structure;
- and
- an electrical connection structure extending through the upper conductive structure and electrically connecting to the lower conductive structure, wherein the electrical connection structure includes a boundary surface disposed in the intermediate layer, wherein the boundary surface includes a recessed surface.
2 more elements
Dependencies are inferred from the claim text.